Payment & Shipping Terms:
|Board Outline Tolerance:||+/-0.10MM||Acceptable File Format:||All Gerber Files, CAM-350, Protel, Pads 2000, CAD, ORCAD, P-CAD And CAM 2000|
|Packing:||Inner Vacuum Packing, Outer Standard Carton Box||Outgoing Reports:||Final Inspection, E-test|
2 layer printed circuit board,
double layer pcb board
Fr4 1.0mm BGA 2 Layer PCB Board Immersion Gold PCB With UL Certificate
Global Success is continuously innovating the technology improving our Rigid PCBCapability to meet customers High-Tech requirement with High-Density, High Multilayer, Greater Aspect Ratio, better Impedance Controlled product.
Our Rigid PCB Capabilities below:
|2||Max. Board Size||864 x 610 mm (34" x 24")|
|3||Min. Board Thickness||0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers)|
|4||Max. Board Thickness||315mil(8mm)|
|5||Max. Copper Thickness||19oz/Inner Layer: 12oz/Outlayers|
|6||Min. Inner Line Width / Space||4mil(0.1mm) / 4mil(0.1mm)|
|7||Min. Outer Line Width / Sapce||4mil(0.1mm) / 3.5mil(0.089mm)|
|8||Min. Finish Hole Size||6mil(0.15mm)|
|9||Max. Aspect ratio||12:1|
|10||Minimum via hole size and pad||via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via|
|11||Minimum hole tolerance||±0.05mm(NPTH), ±0.076mm(PTH)|
|12||Finished hole size tolerance(PTH)||±2mil(0.05mm)|
|13||Finished hole size tolerance(NPTH)||±1mil(0.025mm)|
|14||PTH hole copper thickness||mini 25um(1.0mil)|
|15||Hole Position Deviation||±2mil(0.05mm)|
|18||Insulation Resistance||1 × 1012Ω|
|19||Thermal Shock||3 × 10Sec@288 ℃|
|20||Warp and Twist||≤0.5%|
|21||Peel Strengh||1.4N / mm|
|22||Solder Mask Abrasion||≥6H|
|23||Flammability||94V - O|
|25||Mini Solder mask Opening||0.05mm(2mil)|
|26||Mini solder mask coverage||0.05mm(2mil)|
|27||Mini solder dam||0.076mm(3mil)|
|28||Surface Finish Treatment||Flash gold (Electrolytic);
Electroless nickel Immersion gold (Electroless Ni/Au);
Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead);
Hot Air Leveling (Lead- Free, RoHS);
Carbon Ink, Peelable Mask, Gold Fingers (30µ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um).
|29||G/F Au thickness||0.76um max ( 30u” max )|
|30||V-cut angle||30° 45° 60° ,tolerence +/- 5°|
|31||Mini V-cut board thickness||0.8mm|
|32||V-cut remain thickness tolerance||±0.1mm|
|33||Profiling mode||Routing & Punching|
|35||E-TEST voltage||250 ± 5 V|
|36||Capacity||60,000 square feet (Month)|
Q: Are you trading company or manufacturer ?
A: We are PCB manufacturer with 13 years experience in this area.
Q: How about your delivery date ?
A: support 48 hours express make sample,in general,smaples need 3-5 working days,mass production need 7-14 working days.
Q:What is your minimum order quantity?
A: No MOQ .
Q:What is your advandage than other supplier ?
A: We have over 13 years experience in produce PCB services and have reliable of raw material suppliers. We can find out the best source to consistently reduce your cost.
Q:Is safty for my PCB design for manufacturing?
A: All customer's copyright will never manufacture PCB board for someone else with your files unless we receive written.
Q:How to send the PCBs?
A:For small or express packages, we will ship the boards to you by DHL,TNT,UPS,FedEx,For heavy goods, we may ship your PC boards by ship or by air to save freight cost. we may contact them for dealing with your shipment.